IEEE - Institute of Electrical and Electronics Engineers, Inc. - Flip chip assembly utilizing anisotropic conductive films: a feasibility study

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Delaney, D. ; White, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 641 - 645
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853226
Regular:

There is a persistent effort to miniaturize, reduce costs and search for environmentally friendly alternatives in the semiconductor industry. With the many advantages of flip chip assembly... View More

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