IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assessment of flip chip interconnect integrity using scanning acoustic microscopy

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Wolf, R.K. ; Hooghan, T.K. ; Bachman, M.A. ; Weachock, R.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 633 - 640
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853225
Regular:

This paper describes a non-destructive technique using 50 MHz c-mode scanning acoustic microscopy (CSAM) to characterize thermally accelerated diffusion mechanisms that degrade flip chip solder... View More

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