IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Schubert, A. ; Dudek, R. ; Kloeser, J. ; Michel, B. ; Reichl, H. ; Hauck, T. ; Kaskoun, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 624 - 632
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853224
Regular:

To develop comprehensive design guidelines, models and experiments cannot overlook process-induced imperfections in the flip chip on board (FCOB) assemblies. The following items were noted as... View More

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