IEEE - Institute of Electrical and Electronics Engineers, Inc. - Conduction development in electrically conductive adhesives with a bimodal size distributed conducting and inert particles: effect of polydispersity

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Mikrajuddin ; Shi, F.G. ; Okuyama, K. ; Kim, H.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 609 - 614
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853221
Regular:

A well known approach for reducing the electrical percolation threshold of an electrically conductive material is to mix the relatively small sized conducting fillers with the relatively large... View More

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