IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interface adhesion between copper lead frame and epoxy moulding compound: effects of surface finish, oxidation and dimples

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Jang-Kyo Kim ; Lebbaj, M. ; Liu, J.H. ; Ji Hoon Kim ; Yuen, M.M.F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 601 - 608
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853220
Regular:

A comprehensive study is made of the effects of dimple and finishing material of copper alloy lead frame on interface adhesion with epoxy moulding compound. The surface plating materials studied... View More

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