IEEE - Institute of Electrical and Electronics Engineers, Inc. - Endoscopic inspection of solder joint integrity in chip scale packages

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chan, Y.C. ; Tang, C.W. ; Tu, P.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 569 - 575
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853215
Regular:

This paper reports the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex. Borrowed from the medical instrument... View More

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