IEEE - Institute of Electrical and Electronics Engineers, Inc. - The other side of UV:YAG laser in printed circuit board fabrication, some experiments and experiences, not always microvia related

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Kohler, R. ; Kaminski, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 563 - 568
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853214
Regular:

Driven by silicon and array packaging (BGA, CSP, ...) the printed circuit industry was forced to develop processes for finer structures and smaller vias. The result was the development of a number... View More

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