IEEE - Institute of Electrical and Electronics Engineers, Inc. - Manufacturing productivity improvements for PBGA and flip chip substrates in PWB factory

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chrzanowski, D.E. ; Stanke, D.A. ; Lapcevich, R.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 558 - 562
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853213
Regular:

This paper discusses the new techniques applied to a conventional PWB manufacturing line to improve productivity and maximize capacity for PBGA and flip chip substrate products. We discuss... View More

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