IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGA laminate assembly

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Dufresne, J. ; Ouimet, S. ; Homa, T.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 541 - 548
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853211
Regular:

Component integration is becoming more and more popular to achieve reduction of space with increasing performance of electronic packages. Dual-Chip-Stack (DCS) is the direct, face to face joining... View More

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