IEEE - Institute of Electrical and Electronics Engineers, Inc. - A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Odate, Y. ; Usami, T. ; Otsuka, K. ; Suga, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 526 - 529
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853208
Regular:

In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure... View More

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