IEEE - Institute of Electrical and Electronics Engineers, Inc. - Network analyzer calibration methods for high-density packaging characterization and validation of simulation models

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Hammond, C.L. ; Virga, K.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 519 - 525
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853207
Regular:

A diversity of advanced modeling and simulation tools for application to packaging and interconnect problems have been developed over the past decade. The development of accurate mixed signal and... View More

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