IEEE - Institute of Electrical and Electronics Engineers, Inc. - Module packaging for high-speed serial and parallel transmission

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Karstensen, H. ; Auracher, F. ; Ebel, N. ; Fiedler, J. ; Plickert, V. ; Melchior, L. ; Leininger, L. ; Bittner, M. ; Festag, M. ; Wicke, M. ; Meyer, S. ; Miller, R. ; Kuhn, G. ; Althaus, H.-L. ; Ebberg, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 479 - 486
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853200
Regular:

This paper discusses module packaging aspects with regard to high-speed data transmission for both single channel serial and multi channel parallel transmission. The increasing demand for... View More

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