IEEE - Institute of Electrical and Electronics Engineers, Inc. - RF electrical measurements of fine pitch BGA packages

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Caggiano, M.F. ; Bulumulla, S. ; Lischner, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 449 - 453
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853194
Regular:

A series of fine pitched BGA's were measured on an Network Analyzer using a novel technique to de-embed the package test fixture and provide an accurate representation of the electrical... View More

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