IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Horng, T.S. ; Wu, S.M. ; Li, J.Y. ; Chiu, C.T. ; Hung, C.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 439 - 444
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853192
Regular:

The electrical models of Bump Chip Carrier (BCC) packages have been established based on the S-parameter measurement. When compared to the standard Thin Shrink Small Outline Packages (TSSOP), BCCs... View More

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