IEEE - Institute of Electrical and Electronics Engineers, Inc. - Non-invasive optical assessment of packaging-induced defects in high-power laser diodes

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Barwolff, A. ; Tomm, J.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 421 - 425
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853189
Regular:

Packaging of laser chips or bars is a crucial technological process during production of high power laser devices. The main goal of this process is to mount the semiconductor chip with high... View More

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