IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wire pull on fine pitch pads: an obsolete test for first bond integrity

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Sundararaman, V. ; Edwards, D.R. ; Subido, W.E. ; Test, H.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 416 - 420
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853187
Regular:

This work focuses on the validity and applicability of the wire pull test being used as a measure of first bond integrity of wire bonds on fine pitch pads used in advanced silicon technology... View More

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