IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel method and device for solder joint quality inspection by using laser ultrasound

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Sheng Liu ; Erdahl, D. ; Ume, C. ; Achari, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 408 - 415
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853186
Regular:

A novel, non-contact, non-destructive, on-line approach for flip chip, ball grid array (BGA), chip scale and micro BGA solder joint quality inspection is presented. In this technique, a pulsed... View More

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