IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of interfaces involving electrically conductive adhesives using electron-beam moire and infrared microscopy

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Slifka, A.J. ; Drexler, E.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 403 - 407
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853185
Regular:

The complimentary techniques of electron-beam moire and infrared microscopy were used to determine the mechanical and thermal degradation of interfaces involving electrically conductive adhesives.... View More

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