IEEE - Institute of Electrical and Electronics Engineers, Inc. - CSP assembly reliability and effects of underfill and double-sided population

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Ghaffarian, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 390 - 396
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853183
Regular:

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability... View More

Advertisement