IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip-scale packaging of power devices and its application in integrated power electronics modules

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Xingsheng Liu ; Xiukuan Jing ; Guo-Quan Lu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 370 - 377
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853179
Regular:

We present a power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional integrated power electronics modules (IPEMs). The chip-scale... View More

Advertisement