IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluating underfill materials for high reliability applications

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Goodelle, J.P. ; Gilbert, J.J. ; Fanucci, R.E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 330 - 342
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853172
Regular:

This paper outlines the methodology used to screen for high reliability underfills in a recent materials evaluation conducted in our facility. The goal of this selection process was to rank... View More

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