IEEE - Institute of Electrical and Electronics Engineers, Inc. - Bridging the gap: package level and system level thermal modeling

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Wang, W. ; Liou, S. ; Sun, Y.S. ; Lai, J.Y. ; Tien, C. ; Her, T.D. ; Michael, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 287 - 293
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853165
Regular:

The thermal performance is one of the critical issues in electronic packaging. The thermal data provided by the packaging suppliers are normally on the package level. This is very informative for... View More

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