IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Vrazel, M. ; Chang, J.J. ; Brooke, M. ; Jokerst, N.M. ; Youngjoong Joe ; Carastro, L. ; Dagnall, G. ; Brown, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 223 - 230
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853153
Regular:

High frequency signal distribution in HDI/HDW substrates can be achieved using optical interconnections. To realize effective milli- and micro-haul interconnections on these substrates, the hybrid... View More

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