IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging-compatible microtransformers on a silicon substrate

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Park, J.Y. ; Hong, H.K. ; Bu, J.U.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 206 - 210
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853149
Regular:

Surface micromachining techniques are utilized to realize microtransformers for being integrated with a multi-chip package, allowing compact integration with chips, sensors, and other components.... View More

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