IEEE - Institute of Electrical and Electronics Engineers, Inc. - The influence of room temperature aging on ball shear strength and microstructure of area array solder balls

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Coyle, R.J. ; Solan, P.P. ; Serafino, A.J. ; Gahr, S.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 160 - 169
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853140
Regular:

Solder ball shear strength is determined for ball grid array (BGA) packages in the as-received condition and after solder reflow preconditioning (exposure to multiple solder reflow profiles).... View More

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