IEEE - Institute of Electrical and Electronics Engineers, Inc. - Missing solder ball failure mechanisms in plastic ball grid array packages

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Zhong, C.H. ; Yi, S. ; Mui, Y.C. ; Howe, C.P. ; Olsen, D. ; Chen, W.T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 151 - 159
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853139
Regular:

Plastic ball grid array packages were aged at 125 and 150/spl deg/C for different time intervals from 4 to 2000 hours. Various solder ball pad metallurgy including pure Ni barrier layer... View More

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