IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interface microstructure and mechanical fatigue behavior of Sn/sub 63/Pb/sub 37/ on electroplated Cu and Ni

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Zhang, C. ; Jian-Ku Shang ; Pilin Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 138 - 141
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853135
Regular:

Electroplated Cu and Ni are commonly used as under bump metallurgy (UBM) in flip chip bumping due to their good wetting to common solders. The objective of this study was to understand interface... View More

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