IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructural coarsening of lead free solder joints during thermal cycling

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Li-Lei Ye ; Zonghe Lai ; Liu, J. ; Tholen, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 134 - 137
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853134
Regular:

The present work mainly focuses on the microstructure evolution of Sn-3.5 Ag, Sn-3.4 Ag-3.0 Bi and Sn-3.2 Ag-0.5 Cu solder joints in Pb-coated lead frame and Ni/Au plated Cu surface in thermal... View More

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