IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead-free flip chip process development

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Gafffney, K. ; Poarch, J. ; Delaney, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 129 - 133
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853133
Regular:

With environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. One challenge is to find an alternative solder that is as... View More

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