IEEE - Institute of Electrical and Electronics Engineers, Inc. - Screen printing, placement and joining technologies with lead-free joining materials

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Detert, M. ; Herzog, T. ; Wolter, K.-J. ; Zerna, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 125 - 128
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853132
Regular:

This paper is focused on the results of investigations on lead-free applications in electronics manufacturing. The wide use of electronic components in the field of daily applications, the new... View More

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