IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low temperature fluxless bonding technique using In-Sn composite

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Choe, S. ; So, W.W. ; Lee, C.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 114 - 118
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853130
Regular:

Device packages usually need more than one soldering operation to complete. For photonic and fiber optics devices and packaging, indium solder has become ever more popular due to its ductility.... View More

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