IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Se-Young Jang ; Kyung Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 64 - 68
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853119
Regular:

The effect of a reflow process and under bump metallurgy (UBM) systems on the growth of intermetallic compounds for Sn/Bi and Pb/Sn solder bump/UBM interfaces was investigated. The UBM systems... View More

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