IEEE - Institute of Electrical and Electronics Engineers, Inc. - Kinetics of C4 bump degradation in overly aggressive HTOL

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Master, R.N. ; Blish, R.C. ; Morken, D. ; Adem, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 60 - 63
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853117
Regular:

We will describe the kinetics and mechanism of degradation of flip chip bumps when subjected to overly agressive High Temperature Operational Life tests. Higher temperature is used to shorten the... View More

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