IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of under bump metallization systems for flip-chip assemblies

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Poi Siong Teo ; Yu-Wen Huang ; Chih Hang Tung ; Marks, M.R. ; Thiam Beng Lim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 33 - 39
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853112
Regular:

The objective of this work was to investigate the quality of Under Bump Metallization (UBM) systems used for solder bump flip chip applications. These three commercial UBM systems were... View More

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