IEEE - Institute of Electrical and Electronics Engineers, Inc. - An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Scussat, M. ; Wursch, A. ; Clavel, R. ; Salathe, R.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 26 - 32
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853111
Regular:

Several groups are presently investigating the opportunity to fabricate miniaturized optical devices characterized by high attachment precision. An automated surface mounted technique based on... View More

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