IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ion energy distribution in NF/sub 3/ based process chamber cleaning discharges

IEEE Conference Record - Abstracts. 1999 IEEE International Conference on Plasma Science. 26th International Conference

Author(s): Hsueh, H.P. ; Felker, B.S. ; McGrath, R.T. ; Langan, J.G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Monterey, CA, USA, USA
Conference Date: 24 June 1999
ISBN (Paper): 0-7803-5224-6
ISSN (Paper): 0730-9244
DOI: 10.1109/PLASMA.1999.829326
Regular:

Summary form only given. NF/sub 3/ based discharges are commonly used for cleaning residual silicon dioxide and nitride from plasma enhanced chemical vapor deposition (PECVD) process chambers. In... View More

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