IEEE - Institute of Electrical and Electronics Engineers, Inc. - High-performance silicon MMIC interconnect for millimeter wave wireless communication

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

Author(s): Juno Kim ; Yongxi Qian ; Guojin Feng ; Pingxi Ma ; Chang, M.F. ; Itoh, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 25 October 1999
Page(s): 235 - 238
ISBN (Paper): 0-7803-5597-0
DOI: 10.1109/EPEP.1999.819233
Regular:

This paper presents the authors' latest efforts to develop high performance interconnects for mixed signal silicon MMICs in the millimeter wave regime. The proposed silicon/metal/polyimide... View More

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