IEEE - Institute of Electrical and Electronics Engineers, Inc. - 77 GHz band surface mountable ceramic package

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

Author(s): Koriyama, S. ; Kitazawa, K. ; Minamiue, H. ; Fujii, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 25 October 1999
Page(s): 225 - 228
ISBN (Paper): 0-7803-5597-0
DOI: 10.1109/EPEP.1999.819231
Regular:

We have developed a ceramic package for 77 GHz millimeter wave applications. The package has a new terminal structure for surface mount, and a feedthrough for electromagnetic coupling. We... View More

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