IEEE - Institute of Electrical and Electronics Engineers, Inc. - An integrated environment for the simulation of electrical, thermal and electromagnetic interactions in high-performance integrated circuits

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

Author(s): Gutierrez, H.M. ; Christoffersen, C.E. ; Steer, M.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 25 October 1999
Page(s): 217 - 220
ISBN (Paper): 0-7803-5597-0
DOI: 10.1109/EPEP.1999.819229
Regular:

Joint computer simulation of circuit, thermal and electromagnetic interactions in high performance integrated circuits and systems is of particular importance for the modeling of electronic... View More

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