IEEE - Institute of Electrical and Electronics Engineers, Inc. - Methods to reduce radiation from split ground plane structures [packaging]

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

Author(s): Moran, T.E. ; Virga, K.L. ; Aguirre, G. ; Prince, J.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 25 October 1999
Page(s): 203 - 206
ISBN (Paper): 0-7803-5597-0
DOI: 10.1109/EPEP.1999.819226
Regular:

Methods to reduce radiation from split-ground planes are examined using FDTD analysis. While differential lines and RF chokes to prove to be reasonable solutions, using a corrugated slot is shown... View More

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