IEEE - Institute of Electrical and Electronics Engineers, Inc. - Rapid resin mold with embedded thin film pressure/temperature sensors

IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society

Author(s): Luo, R.C. ; Lin, C.E. ; Chen, C.M. ; Chen, Y.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Jose, CA, USA, USA
Conference Date: 29 November 1999
Volume: 3
ISBN (Paper): 0-7803-5735-3
DOI: 10.1109/IECON.1999.819399
Regular:

In this paper we have developed a new approach by embedding sensors into rapid resin mold's core and cavity for directly measuring the pressure and temperature information for the purpose of... View More

Advertisement