IEEE - Institute of Electrical and Electronics Engineers, Inc. - A review of analytical techniques for process control of contaminants introduced during ion implantation

1998 International Conference on Ion Implantation Technology. Proceedings. Ion Implantation Technology - 98

Author(s): Biswas, S. ; Kelly, I. ; Chia, V.K.F. ; Lindley, P. ; Edgell, M.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Kyoto, Japan, Japan
Conference Date: 22 June 1998
Volume: 1
ISBN (Paper): 0-7803-4538-X
DOI: 10.1109/IIT.1999.812194
Regular:

During the ion implantation process wafers may be contaminated by transition metals, mobile ions, carbon, and organics. These contaminants may arise from (i) deposition onto the surface of the... View More

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