IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer contamination and particles resulting from cooling-pad elastomer

1998 International Conference on Ion Implantation Technology. Proceedings. Ion Implantation Technology - 98

Author(s): LaFontaine, M. ; Alvarado, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Kyoto, Japan, Japan
Conference Date: 22 June 1998
Volume: 1
ISBN (Paper): 0-7803-4538-X
DOI: 10.1109/IIT.1999.812185
Regular:

A new, ultrapure silicone formulation recently introduced by Genus contains extremely low amounts of impurities. Front- and back-side levels of contaminants were measured on wafers which were... View More

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