IEEE - Institute of Electrical and Electronics Engineers, Inc. - 8250 electrostatic clamp performance

1998 International Conference on Ion Implantation Technology. Proceedings. Ion Implantation Technology - 98

Author(s): Reimund, J. ; Lillian, P. ; Becker, K. ; St. Angelo, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Kyoto, Japan, Japan
Conference Date: 22 June 1998
Volume: 1
ISBN (Paper): 0-7803-4538-X
DOI: 10.1109/IIT.1999.812107
Regular:

The need for higher yields and reduced contamination have been driving factors for developing and using electrostatic wafer clamps. Electrostatic Clamps (ESC) do not make contact with the device... View More

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