IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging optoelectronic stacked processors and free-space optical interconnects

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting

Author(s): Esener, S. ; Marchand, P. ; Ozguz, V. ; Liu, Y. ; Huang, D. ; Zheng, X.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 8 November 1999
Volume: 1
ISBN (Paper): 0-7803-5634-9
ISSN (Paper): 1092-8081
DOI: 10.1109/LEOS.1999.813493
Regular:

The 3D-OESP Consortium is a government-industry-university collaboration dedicated to the development of the technologies required to integrate stacked silicon chips with optoelectronic... View More

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