IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optoelectronic chip on film (OE-COF) packaging technology

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting

Author(s): Takahara, H. ; Koshoubu, N. ; Hirata, H. ; Ishizawa, S. ; Ishibashi, S. ; Tsunetsugu, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 8 November 1999
Volume: 1
ISBN (Paper): 0-7803-5634-9
ISSN (Paper): 1092-8081
DOI: 10.1109/LEOS.1999.813492
Regular:

The concept of optoelectronic chip on film (OE-COF) packaging is illustrated. An OE film consists of an optical waveguide film on which impedance-matched electrical line anti bump-bonding pads are... View More

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