IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mechanical clip-on and flip-chip assembly on silicon submount for self aligned fiber to waveguide coupling

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting

Author(s): Porte, H. ; Armbruster, V. ; Kaou, N. ; de Labachelerie, M. ; Mollier, P. ; Devoldere, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 8 November 1999
Volume: 2
ISBN (Paper): 0-7803-5634-9
ISSN (Paper): 1092-8081
DOI: 10.1109/LEOS.1999.812008
Regular:

Flip chip bonding by use of solder bumps has been widely developed to hybridize active devices such as lasers, detectors, and amplifiers, onto silicon microbenches. We report here a new method... View More

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