IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of joint strength of PbSn and AuSn solders on temperature cycling tests in laser packages

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting

Author(s): Chang, H.L. ; Wang, S.C. ; Wang, C. ; Wang, C.M. ; Shi, T.T. ; Sheen, M.T. ; Chien, C.P. ; Chen, J.C. ; Wang, G.L. ; Kuang, J.H. ; Hsieh, K.C. ; Cheng, W.H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 8 November 1999
Volume: 2
ISBN (Paper): 0-7803-5634-9
ISSN (Paper): 1092-8081
DOI: 10.1109/LEOS.1999.811976
Regular:

The effect of joint strength of PbSn and AuSn solders on temperature cycling tests in laser packages has been studies experimentally and numerically. It was found that the joint strength increased... View More

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