IEEE - Institute of Electrical and Electronics Engineers, Inc. - High speed MiniDIL package technology

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting

Author(s): Morioka, S. ; Yanagisawa, M. ; Wada, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 8 November 1999
Volume: 2
ISBN (Paper): 0-7803-5634-9
ISSN (Paper): 1092-8081
DOI: 10.1109/LEOS.1999.811782
Regular:

With the drastic expansion of Internet usage, the demand for high-speed transmission devices, especially 2.4 Gb/s for metropolitan networks, is increasing. The key needs for the establishment of... View More

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