IEEE - Institute of Electrical and Electronics Engineers, Inc. - EMC performance of IC packages

Proceedings of 1999 International Symposium on Electromagnetic Compatibility (EMC'99)

Author(s): Rollin, J.J. ; Areari, G. ; Roy, L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Seattle, WA, USA, USA
Conference Date: 2 August 1999
Volume: 1
ISBN (Paper): 0-7803-5057-X
DOI: 10.1109/ISEMC.1999.812865
Regular:

There are obvious benefits to controlling electromagnetic interference (EMI) directly at the chip level through appropriate integrated circuit (IC) packaging. This paper presents radiated emission... View More

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